| 摘要 |
<p>PURPOSE:To provide a highly reliable structure and method for electrically connecting conductor layers of a multilayered metallic base substrate to each other by which the conductors can be easily electrically connected to each other and chip parts, terminals, etc., can be surely fixed at their mounting time. CONSTITUTION:A hole 6 in which the surface of the lower conductor layer 3 of a metallic base substrate A having a multilayered circuit structure is exposed is formed from the upper conductor layer 1 of the substrate A and a recessed section 8 is formed on the surface of the layer 1 by forming a resist layer 7 around the opening section X of the hole 6. Then at least the hole 6 is filled with a conductor M so as to electrically connect the layers 1 and 3 to each other.</p> |
