| 摘要 |
<p>PURPOSE:To facilitate circuit pattern design on a circuit board by disposing at multidirectional positions lead terminals which have been drawn in one direction. CONSTITUTION:A circuit board 3 is mounted on a beat dissipation plate 4 4. Mounted on the circuit board 3 are the inner portions of lead terminals 2, a semiconductor chip 5 for amplification, a circuit element 6, connecting tabs 7 and the like, which are electrically connected to the circuit board 3. The circuit board 3 is sealed by the board 4 and a sealing cap 9. In addition, the semiconductor chip 5 is electrically connected to the connecting tabs 7 through bonding wires 8. Furthermore, lead terminals 2 of different functions are disposed at multidirectional portions. Since this construction can facilitate the design of a circuit pattern 10 of a semiconductor device for high-frequency power amplification 1 and obviate cross wirings such as bias lines, the circuit pattern 10 can be simplified.</p> |
