| 摘要 |
PURPOSE:To raise the reliability on junction and besides, remove the fear of a solder bridge occurring, concerning the mounting method for a leadless pack age. CONSTITUTION:An inner solder bump 23 is provided on the inner pad 21 of a board 20, and also an outer solder bump 24, whose apex is right below the center of an outer land 16 and whose height is lower by a desired amount than the apex of the inner solder bump 23, is provided on the outer pad 22 of the board 20, and a leadless package 10 is pressed against the board 20 and is heated, whereby it is soldered. |
