发明名称 ELECTRICAL CONNECTING STRUCTURE BETWEEN CASING AND SUBSTRATE OF IC CARD
摘要 PURPOSE:To increase mechanical strength by enabling a casing, including a metal cover, and a substrate to be electrically connectable surely, eliminating handling a small spring part, facilitating assembling, and supporting the metallic cover. CONSTITUTION:Plate springs 14 and 15, having electrical potential the same as that of a metallic cover 12, are point-welded to the metal cover 12 (P). Land 13a on a substrate 13 and the metallic cover 12 are electrically connected to the substrate 13 retained by the plate springs 14 and 15.
申请公布号 JPH0668918(A) 申请公布日期 1994.03.11
申请号 JP19920215833 申请日期 1992.08.13
申请人 MURATA MFG CO LTD 发明人 OKADA MASANOBU
分类号 H01R4/64 主分类号 H01R4/64
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