| 摘要 |
<p>PURPOSE:To provide a multi-pin small-sized semiconductor device package by providing leads suitable for mounting a highly integrated LSI chip. CONSTITUTION:On an LSI chip 11, two rows of pads (edge side pads 12, center side pads 13) are formed. The inner leads are a two-layer structure consisting of an upper inner lead 14 and a lower inner lead 15, which are insulated from each other via an insulating resin 16. The lower inner lead 15 is connected to the edge side pad 12 via bump 17, while the upper inner lead 14 is connected to the center side pad 13 by a bonding wire 18.</p> |
