| 摘要 |
<p>PURPOSE:To provide a dicing tape used for dicing a semiconductor wafer or the like which facilitates the control of the cutting depth with a diamond blade. CONSTITUTION:An adhesive tape 10 for adhering and holding an object to be machined such as a semiconductor wafer when a diamond blade cuts the object, wherein a substrate film part 11 is composed of multiple layers colored with different colors respectively, thereby recognition of the cutting depth into the adhesive tape becomes possible when the object is cut.</p> |
