| 摘要 |
PURPOSE:To obtain a highly reliable multilayered printed wiring board on which soldering can be easily and accurately performed in through holes connecting multilayered printed circuits to each other. CONSTITUTION:The outside diameter of the connection land of the innermost printed wiring board of inner- and outer-printed wiring boards 30, 40, and 50 is made larger than the diameter of the through hole of the outermost printed board and, at the same time, the diameters of through holes 16, 17, and 18 are made larger on the boards 40 and 50 sides against the board 30 side. In addition, a laminated body is formed by piling up the boards 30, 40, and 50 and fixing the boards to each other with a plurality of screws 20. Then, after installing thin wires 21 in the holes 16, 17, and 18, the holes 16, 17, and 18 are filled up with solder by utilizing the capillary actions of the wires 21 so as to electrically connects the boards 30, 40, and 50 to each other. Thus the title board is constituted. |
