| 摘要 |
PURPOSE:To obtain a polyimide multilayered wiring board manufacturing method by which the problems of the deterioration of wiring density and manufacturing yield and elongation of the lead time can be solved even when the number of constituent layers of a multilayered printed board is increased. CONSTITUTION:In a multilayered wiring board provided with a polyimide multilayered wiring layer, a glass plate 1 on which a polyimide multilayered wiring layer is formed and a ceramic substrate 10 on which a polyimide multilayered wiring layer is formed are stuck to each other under a pressurizing and heating condition. A the time of sticking the plate 1 to the substrate 10, connection bumps 8 and via holes 17 formed on the surface of the plate 1 are also stuck to the corresponding connection bumps 8 and via holes 17 formed on the surface of the substrate 10. Since the plate 1 is ground with a grinder and melted in a short time with an etching liquid, the high-density multilayered wiring board can be formed in a short lead time. In addition, since the dipping time of the board in the etching liquid is short, the influence of the etching liquid on the wiring of this board can be reduced. |
