发明名称 PRINTED WIRING BOARD
摘要 PURPOSE:To acquire a printed wiring board which can surely prevent reduction of a life of an electronic component and malfunction of a circuit and can be manufactured relatively readily at a low cost. CONSTITUTION:An aluminum radiator H1 is attached to an outermost layer of a wiring board body 1. The radiator H1 and a ground pattern are electrically connected through a solid radiation pattern 2. Heat generated from a general electronic component, etc., is conducted to the radiator H1 through the ground pattern and the radiation pattern 2b. Heat is dissipated to the outside of the printed wiring board 10 from a fin 7 of the radiator H1.
申请公布号 JPH0669613(A) 申请公布日期 1994.03.11
申请号 JP19920221642 申请日期 1992.08.20
申请人 IBIDEN CO LTD 发明人 KOMORI OSAMU;OHATA MAKIO
分类号 H05K1/02;H05K1/00;H05K3/40;H05K3/46;H05K7/20;(IPC1-7):H05K1/02 主分类号 H05K1/02
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