RESIN ENCAPSULATION MOLD SEMICONDUCTOR DEVICE,申请号JP19920242684-传众专利搜索

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发明名称	RESIN ENCAPSULATION MOLD SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH0669262(A)	申请公布日期	1994.03.11
申请号	JP19920242684	申请日期	1992.08.19
申请人	NEC CORP	发明人	AIBA MASATO
分类号	B29C45/26;B29C45/34;H01L21/56;(IPC1-7):H01L21/56	主分类号	B29C45/26
代理机构		代理人
主权项
地址

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