摘要 |
<p>PURPOSE:To automatically correct an ultrasonic wave oscillation output at the time of its timing by previously storing the timing for correcting the output. CONSTITUTION:The wire bonding method comprises the steps of previously storing at least one correcting timing pattern of a first correcting timing pattern for correcting bonding of ICs 21, 22,... before a first bond 41 of a first wire 31, a second correcting timing pattern for correcting wires 31, 32,... before the first bond 41 in the wires 31, 32,... and a third correcting timing pattern for correcting the wires 31, 32,... before the bond 41, a second bond 42, selecting one of the patterns, and automatically correcting an ultrasonic wave oscillation output. Thus, one of the patterns is selected to automatically correct the output.</p> |