发明名称 WIRE BONDING METHOD
摘要 <p>PURPOSE:To automatically correct an ultrasonic wave oscillation output at the time of its timing by previously storing the timing for correcting the output. CONSTITUTION:The wire bonding method comprises the steps of previously storing at least one correcting timing pattern of a first correcting timing pattern for correcting bonding of ICs 21, 22,... before a first bond 41 of a first wire 31, a second correcting timing pattern for correcting wires 31, 32,... before the first bond 41 in the wires 31, 32,... and a third correcting timing pattern for correcting the wires 31, 32,... before the bond 41, a second bond 42, selecting one of the patterns, and automatically correcting an ultrasonic wave oscillation output. Thus, one of the patterns is selected to automatically correct the output.</p>
申请公布号 JPH0669291(A) 申请公布日期 1994.03.11
申请号 JP19920236382 申请日期 1992.08.12
申请人 SHINKAWA LTD 发明人 MOCHIDA TORU;TERAKADO YOSHIMITSU
分类号 H01L21/607;B23K20/10;H01L21/60;(IPC1-7):H01L21/607 主分类号 H01L21/607
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