| 摘要 |
A process for selectively plating separate surfaces of a component. The process includes electroplating a first material onto a first surface, applying a masking agent to the component, tumbling a plurality of components to remove the masking agent from a second surface, electroplating a second material onto the second surface, the masking agent preventing electroplating on the first surface, and then removing the masking agent from the first surface. |
