PACKAGE MOLDING DIE,申请号KR19900020465U-传众专利搜索

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发明名称	PACKAGE MOLDING DIE
摘要
申请公布号	KR940001269(Y1)	申请公布日期	1994.03.09
申请号	KR19900020465U	申请日期	1990.12.21
申请人	SAMSUNG ELECTRONICS CO., LTD.	发明人	LEE, CHUNG - U;SONG, YONG - JAE
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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