发明名称 |
Adhesive tapes and semiconductor devices. |
摘要 |
Adhesive tapes suitable for use in wire-bonded semiconductor devices are disclosed. They are each composed of a heat-resistant substrate formed of at least one layer, a copper foil provided on one side of the substrate, and a semi-cured adhesive layer and a protective film provided successively on the other side of the substrate. Semiconductor devices fabricated using such adhesive tapes are also disclosed. |
申请公布号 |
EP0400566(B1) |
申请公布日期 |
1994.03.09 |
申请号 |
EP19900110140 |
申请日期 |
1990.05.29 |
申请人 |
TOMOEGAWA PAPER CO. LTD. |
发明人 |
SAKUMOTO, YUKINORI;YOKOYAMA, SHIGEYUKI;SHIBUYA, AKIHIRO;NAKAYAMA, NOBUYUKI;KOSHIMURA, ATSUSHI |
分类号 |
B32B15/08;C09J7/02;H01L23/495;H05K3/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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