Method of providing a integrated waveguide combiner

摘要

A microwave power combiner includes a first plate having disposed in a first surface thereof a first plurality of grooves and a second plate having disposed in a first surface of said second plate a second plurality of grooves, with said second plate being mated to said first plate and with said first plurality of grooves in the first plate disposed in alignment with the second plurality of grooves in the second plate to provide a plurality of waveguide regions. The waveguide regions are further disposed to provide a plurality of hybrid Ts preferably matched hybrid Ts or magic Ts which are selectively interconnected to form an integrated combiner structure. A first surface of the plate is used to mount a plurality of IMPATT diode modules whereas the second opposite surface of the composite plate is used to mount a heat sink thereby providing a thermal path between the diode modules through the composite plates to the heat sink. In an alternate embodiment, the waveguide regions are provided by casting a plate about a sacrificial mandrel which has the desired configuration of the waveguide regions.