| 摘要 |
An apparatus for inspecting, for example, balls and crescents of wires bonded between a semiconductor chip and a lead frame including an optical system installed above an object of inspection, a vertical illuminator that illuminates the object of inspection, a CCD camera which has a photoelectric converter element provided at an imaging level of the optical system, and X, Y and Z tables which move the CCD camera in the X, Y and Z directions. Since only the photoelectric converter element of the CCD camera is movable in the X, Y and Z directions when focusing is made into the object of inspection, the size of the X, Y and Z tables can be small, and in addition, since the optical system and vertical illuminator are not movable, dirt is prevented from falling onto the object of inspection.
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