| 摘要 |
PCT No. PCT/DE90/00943 Sec. 371 Date Jun. 18, 1992 Sec. 102(e) Date Jun. 18, 1992 PCT Filed Nov. 30, 1990 PCT Pub. No. WO91/08327 PCT Pub. Date Jun. 13, 1991.A process and apparatus are disclosed for controlling the flow of operations in electroplating plants with horizontal throughflow in which the parts to be electroplated, in particular plate-shaped parts, pass through the plant in succession and are electroplated by means of currents applied by anodes. In order to prevent undesirable, increased precipitation on the front faces or edges of parts to be electroplated which follow each other at undesirable distances apart, or at least to reduce this precipitation to an acceptable level, the position of the parts which pass through the plant in succession and/or the distances between these parts are detected and the application of the electroplating currents is controlled as a function of these positions and/or distances by switching the anodes on and off, in such a manner that the flux density is approximately the same in all regions of the parts.
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