发明名称 |
Integrated circuit package |
摘要 |
The present integrated circuit package provides both a high density of conductor poles, and reduced crosstalk noises between the conductor poles. The conductor poles are received within holes in an insulating substrate. The insulating substrate has a laminated, multi-layer ceramic substrate structure comprising insulating plates having metallized layers thereon which constitute a portion of the walls of the holes. In addition, insulating layers for insulating the metallized layers from the conductor poles are formed within a selected number of the holes.
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申请公布号 |
US5293502(A) |
申请公布日期 |
1994.03.08 |
申请号 |
US19920868567 |
申请日期 |
1992.04.15 |
申请人 |
NGK SPARK PLUG CO., LTD. |
发明人 |
KIMURA, YUKIHIRO;MIYAWAKI, NOBUHIKO;KURODA, MASAO |
分类号 |
H01L23/13;H01L21/48;H01L23/12;H01L23/14;H01L23/498;(IPC1-7):H05K01/00 |
主分类号 |
H01L23/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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