Method for forming vias in multilayer circuits

摘要

The invention is directed to a method for rapidly forming a pattern of vias in multilayer electronic circuits in which each of the via holes is formed by drilling with a controlled number of Nd:YAG laser beam pulses. Beam positioning is controlled by means of a programmed galvanometric beam positioner. The drilling sequence is optionally controlled by application of an heuristic algorithm of the symmetric Traveling Salesman Problem.