| 摘要 |
<p>PURPOSE:To provide the manufacture of a laminated board, which has excellent adhesive properties and corrosion resistance, in which no peeling and blister phenomenon with time is generated and which can be contact-bonded at a low temperature. CONSTITUTION:(1) The treatment of purification, activation or formation is carried out to a blank in a surface treating process. (2) The blank is coated with undercoat paints, in which a crosslinking agent and rust resisting paints are compounded with an epoxy, epoxy/acrylic or polyester resin, and a dried film in 1-20mum is formed and baked and treated in an undercoat coating process. (3) An undercoat coating surface is coated with adhesives mainly comprising an acrylic, rubber, epoxy, urethane, polyester, olefin or amide resin and heated within the range of a board temperature of 100-170 deg.C and an adhesive layer in dried film thickness of 1-20mum is formed in an adhesive coating process. (4) A resin film is press-contacted with an adhesive coated surface within a temperature range of 100-170 deg.C in a laminating process. The processes are carried out successively.</p> |
