| 摘要 |
<p>PURPOSE:To provide an electronic direction indicator, which can be made compact and light and which has the excellent heat radiating property of a semi-conductor active element. CONSTITUTION:Since chip-like passive elements C1, C2, R and semiconductor chips 6-8 are connected to lead frames l-5 for carrying by conductive paste, solder or bonding wire, and they are molded by a resin mold, the resin mold quantity becomes minimum, and furthermore, a printed board can be omitted to make a device compact and light. Since the semi-conductor chips 6-8 radiates the heat through the mold resin at a thickness as same as that of a resin package type semi-conductor active element, heat radiating property can be improved in comparison with the case of resin-molding of a package, in which semi-conductor chips are housed.</p> |
