发明名称 THERMOPLASTIC MOLDING COMPOUND
摘要 The thermoplastic moulding materials contain A) an ABS-type resin, B) an aromatic polycarbonate resin, C) a carboxyl-carrying polymer resin, and optionally D) further polymer resins, characterised in that component A is an ABS resin containing at least one basic additive, component C is selected from C.1) a polymer resin containing from 40 to 62.5 % by weight of carboxyl groups (-COOH) which is derived from acrylic or methacrylic acid polymers or acrylic or methacrylic acid copolymers or C.2) a polymer resin containing from 5 to 30 % by weight of carboxyl groups (-COOH) which has been obtained by polymerisation of at least two monomers selected from styrene, acrylonitrile and acrylates and/or methacrylates with acrylic acid and/or methacrylic acid, and the weight ratio between the basic additive in A) and the carboxyl groups in C) has a value of 5:1 to 1:1 (when polymer resin C.1 is used) or a value of 3:1 to 1:3 (when polymer resin C.2 is used).
申请公布号 JPH0657091(A) 申请公布日期 1994.03.01
申请号 JP19930178572 申请日期 1993.06.28
申请人 BAYER AG 发明人 HERUBERUTO AIHENAUAA;KAARUUHAINTSU OTSUTO;ARUFUREETO PISHIYUCHIYAN;KAARUUERUBIN PIIJIKO
分类号 C08K5/00;C08L33/00;C08L33/04;C08L55/00;C08L55/02;C08L69/00;(IPC1-7):C08L55/02 主分类号 C08K5/00
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