A resist pattern on a substrate is formed using an imageable resist layer on the surface of a substrate. The imageable resist layer comprises a silicon-incorporated polystyrene-diene block copolymer having a silicon weight percent of at least about 5 percent. The imageable layer is prepared by reacting a polystyrene-diene block copolymer with a silicon-containing compound in the presence of a platinum catalyst. In a preferred embodiment, the poly(styrene)-diene block copolymers are hydrosilylated by hydrosiloxanes using a platinum-divinyl tetramethyl disiloxane catalyst.
申请公布号
US5290397(A)
申请公布日期
1994.03.01
申请号
US19920934088
申请日期
1992.08.21
申请人
CORNELL RESEARCH FOUNDATION, INC.
发明人
OBER, CHRISTOPHER K.;GABOR, ALLEN H.;LEHNER, ERIC A.;MAO, GUOPING;SCHNEGGENBURGER, LIZABETH A.