| 摘要 |
<p>The invention relates to a device for cooling a ceiling. The device comprises a ceiling panel with a passage for a fluid, which is incorporated in a first cooling circuit, and a cooling tower which is incorporated in a further cooling circuit. The first cooling circuit and the further cooling circuit are in direct heat-exchanging contact with one another via a heat exchanger, and the cooling passage is formed integrally with the ceiling panel. The ceiling panel preferably comprises aluminium and acts extremely well if it is extruded as a single unit, thus preventing transitional losses. Preferably, the ceiling panel comprises a plate-like part on which a tubular part with cooling passage is formed via a web. To achieve a good cooling action, it is advantageous if air can also reach the area above the ceiling panel.</p> |
