发明名称 RESIN LIQUID SPRAY NOZZLE FOR PLATE MOLDED BODY MANUFACTURING DEVICE
摘要 PURPOSE:To provide a spray nozzle for a plate molded body manufacturing device capable of spraying resin liquid comparatively uniformly on a plurality of fiber bundles made in such a manner that a large number of long fibers are bundled and arranged in a thin layer and made to proceed continuously to an impregnating stage. CONSTITUTION:A large number of long fibers are bundled and arranged in a thin layer, and a plurality of fiber bundles G are made to proceed continuously to an impregnating stage. A plate molded body manufacturing device comprises a spray nozzle for spraying expansion setting resin liquid on the fiber bundles G by reciprocating in the cross direction. Discharge outlets 11a and 11b of the spray nozzle 2 are arranged downwardly at two parts or more with their positions deviated obliquely with respect to the cross direction of the fiber bundles G.
申请公布号 JPH0655644(A) 申请公布日期 1994.03.01
申请号 JP19920211258 申请日期 1992.08.07
申请人 SEKISUI CHEM CO LTD 发明人 IWAI HIDEO;YASUDA HIDEKAZU
分类号 B05B1/14;B29C70/06;B29C70/30;B29K105/04;B29K105/08;B29L7/00;(IPC1-7):B29C67/14 主分类号 B05B1/14
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