发明名称 |
RESIN LIQUID SPRAY NOZZLE FOR PLATE MOLDED BODY MANUFACTURING DEVICE |
摘要 |
PURPOSE:To provide a spray nozzle for a plate molded body manufacturing device capable of spraying resin liquid comparatively uniformly on a plurality of fiber bundles made in such a manner that a large number of long fibers are bundled and arranged in a thin layer and made to proceed continuously to an impregnating stage. CONSTITUTION:A large number of long fibers are bundled and arranged in a thin layer, and a plurality of fiber bundles G are made to proceed continuously to an impregnating stage. A plate molded body manufacturing device comprises a spray nozzle for spraying expansion setting resin liquid on the fiber bundles G by reciprocating in the cross direction. Discharge outlets 11a and 11b of the spray nozzle 2 are arranged downwardly at two parts or more with their positions deviated obliquely with respect to the cross direction of the fiber bundles G. |
申请公布号 |
JPH0655644(A) |
申请公布日期 |
1994.03.01 |
申请号 |
JP19920211258 |
申请日期 |
1992.08.07 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
IWAI HIDEO;YASUDA HIDEKAZU |
分类号 |
B05B1/14;B29C70/06;B29C70/30;B29K105/04;B29K105/08;B29L7/00;(IPC1-7):B29C67/14 |
主分类号 |
B05B1/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|