| 摘要 |
PCT No. PCT/JP91/01721 Sec. 371 Date Aug. 17, 1992 Sec. 102(e) Date Aug. 17, 1992 PCT Filed Dec. 17, 1991.There is disclosed a semiconductor device having an insulating film formed on a substrate in which a semiconductor element is formed; an electrode pad is formed on the insulating film and is electrically connected to the semiconductor element by a signal line; an insulating protective film which covers the semiconductor substrate and has an opening for connecting an external circuit connection device to expose the surface of the electrode pad and an exposing opening, provided at peripheral portion of the electrode pad, for exposing a side of the electrode pad; and an external circuit connection device connected to the electrode pad via the opening for connecting. Since the side of the electrode pad can be exposed by forming an exposing opening in the insulating film, in the case where the inner lead is connected to the electrode pad via bump using ILB or the case where the wire bonding is applied to the electrode pad, the force applied to the electrode pad can be released by deformation of the electrode pad.
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