摘要 |
A pick and plate apparatus for use in an automatic test handler picks up electronic devices from one type of tray, transfer the electronic devices in a horizontal plane to another type of tray, and places the electronic devices in a predetermined position on the other tray for testing and sorting. The pick and place apparatus includes a plurality of suction inlets for picking up the electronic devices from the tray with suction power caused by a vacuum, a guide frame for slidably mounting the plurality of suction inlets in a horizontal direction, a mechanism for providing up-and-down movement to the suction inlets for picking up the electronic devices from the one tray and placing the device in the other tray, and a mechanism for adjusting the spacing of the suction inlets to compensate for the differences in spacing between one tray and another tray.
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