| 摘要 |
A method of manufacturing a semiconductor device including a MOS transistor, wherein a second resist pattern having openings respectively defining gate, source, and drain regions is formed while leaving a first resist pattern on a gate material film, i.e., a polycrystalline silicon film, which is used to form a gate electrode. Impurities are implanted into the source and drain regions by using the first and second resist patterns as a mask. The impurities are stopped in the inside of the first resist pattern on the gate and are not implanted into the gate.
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