| 摘要 |
PURPOSE:To provide a bump inspecting apparatus which can accurately detect a defect of a connecting part of a pad to a bump in the apparatus for inspecting by transmitting the bump formed at a pad of a printed board with an X-ray. CONSTITUTION:A bump inspecting apparatus inspects bumps 14a, 14b formed at pads 12-1a, 12-1b of printed boards 10-1, 10-2 by transmitting with an X-ray, and comprises a sample stage for placing the boards 10-1, 10-2, a main X-ray source 22 for irradiating the bumps 14a, 14b formed on the pads 12-1a-12-1b of the boards 10-1, 10-2 perpendicularly with a main X-ray, a main X-ray sensor 24 for detecting the main X-ray transmitted through the bumps 14a, 14b to image it, a sub X-ray source 26 having a lower beam power source voltage than that of the source 22 to irradiate the bumps 14a, 14b with a sub X-ray at an angle theta close to a tangent to be decided according to a pitch and a height of the bumps 14a, 14b, and a sub X-ray sensor 28 for detecting the sub X-ray passed through the bumps 14a, 14b to image it.
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