发明名称 WIRING BOARD
摘要 PURPOSE:To obtain a wiring board with wiring conductors formed without line disorder with high precision and with excellent adhesion to the board, and free from protruding from the upper surface of the board. CONSTITUTION:Grooves of a specified pattern are provided on the upper surface of a glass board 2, and wiring conductors are formed by burying metal oxide films 3 and conductive materials 4 in the grooves 2a. Accordingly, it becomes possible to form the wiring conductors along the groove pattern with high precision without line disorder. In addition, it becomes possible to increase the thickness of the wiring conductors preventing them from protruding from the upper surface of the board 2 by making the grooves deeper. And it is possible to make the wiring conductors have specified values of resistance, even when the wiring conductors have to be formed extremely narrow in width. Besides, it becomes possible to prevent the wiring conductors from exfoliating, floating up, etc., securely, by raising the adhesion of the conductive materials 4 to the glass board 2 by the use of the metal oxide films 3.
申请公布号 JPH0653632(A) 申请公布日期 1994.02.25
申请号 JP19920203716 申请日期 1992.07.30
申请人 TAIYO YUDEN CO LTD 发明人 IIDA HIDEYO;SHIBA NOBUYASU
分类号 G02F1/1343;H01B13/00;H01J11/32;H01J11/34;H01J11/36;H01J11/44;H01J11/46;H01J17/04;H05K1/02;H05K1/03;H05K3/10;H05K3/38 主分类号 G02F1/1343
代理机构 代理人
主权项
地址