发明名称 PACKAGE FOR ENCLOSING ELECTRONIC PART
摘要 PURPOSE:To provide a package for enclosing an electronic part which can operate the electronic part enclosed inside normally and stably, with great noise shielding effect. CONSTITUTION:This is a package 1 for enclosing an electronic part, which consists of a substrate 2 having a signal line 5a and a ground line 5b and besides having a mount A on which an electronic part is mounted and a cover 3 having a recess B for accommodating the electronic part mounted on the mount A inside. The substrate 2 and the cover 3 are joined hermetically through a sealing material 8. And, the signal line 5a of the substrate 2 is sandwiched with the grand lines 5b, and besides the inwall of the recess B of the cover 3 is covered with a metallic layer 9, and also the metallic layer 9 is connected electrically to the ground line 5b of the substrate 2.
申请公布号 JPH0653355(A) 申请公布日期 1994.02.25
申请号 JP19920203646 申请日期 1992.07.30
申请人 KYOCERA CORP 发明人 KUWATA YOSHIMICHI;KATORI NAOHIRO
分类号 H01L23/04;H01L23/12;H01L23/14;H01L23/50;(IPC1-7):H01L23/12 主分类号 H01L23/04
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