MULTILAYER CIRCUIT SUBSTRATE AND ITS MANUFACTURE

摘要

PURPOSE:To prevent a dent from being generated on the surface of via hole conductor filling the via hole and eliminate conduction failure of via hole conductor when the through hole is filed with conductive paste which becomes the via hole conductor. CONSTITUTION:A multilayer circuit board 10 is formed by glass-ceramics. A via hole conductor 5 connecting between internal wirings 3 and between the internal wiring 3 and surface wiring is formed by baking a conductive paste formed by mixing conductive powder, inorganic binder and organic vehicle. This via hole conductor 5 also has a weight average molecules of about 7.2X10<4> to 2.1X10<5> and also includes an organic binder of 3 to 5wt.% that of the total organic vehicle.