发明名称 MULTILAYER PRINTED CIRCUIT BOARD
摘要 <p>PURPOSE:To reduce the number of pull-up resistors and pull-down resistors and a power consumption by providing a low resistance insulator between a signal line layer and a power supply layer or a ground layer and also providing an insulator between the power supply layer and the ground layer CONSTITUTION:Low resistance insulators 26, 29 are provided between a signal layer 21 and a power supply layer 22 and between the power supply layer 24 and signal layer 25, while ordinary insulators 27, 28 are provided between the power supply layer 22 and the ground layer 23 and between the ground layer 23 and the power supply layer 24. In this structure, a current is leaked to a signal line of the signal layer 21 via a low insulator 26 from a conductive wiring pattern of the power supply layer 22 and a current is leaked to a signal line of the signal layer 25 via a low resistance insulator 29 from the conductive wiring pattern of the power supply layer 24. Therefore, a leaked current can be supplied to an input terminal by connecting an input terminal to be pulled up of the IC packages 30, 31 to the wiring of each signal line layer. Thereby, it is no longer required to use a pull-up resistor.</p>
申请公布号 JPH0653661(A) 申请公布日期 1994.02.25
申请号 JP19920205046 申请日期 1992.07.31
申请人 FUJITSU LTD 发明人 YOKOTA TAKAHIRO
分类号 H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/46
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