发明名称 BONDING MECHANISM FOR BONDING FACES NOT LYING ON THE SAME PLANE
摘要 PURPOSE:To bond a wire onto a bonding face even in the case that there is no space for a capillary to get in above a bonding face, or even in the case that there is no rotary mechanism in a holding part. CONSTITUTION:In case that a bonding face 2 is not parallel with a bonding face 1 for first bonding, a base 4, where a plane 3 parallel with the bonding face 1 is made, is attached to the bonding face 2, and a wire is bonded to the plane 3 of the base 4.
申请公布号 JPH0653267(A) 申请公布日期 1994.02.25
申请号 JP19920224875 申请日期 1992.07.31
申请人 ANDO ELECTRIC CO LTD 发明人 FUJITA KIYOHISA
分类号 H01L21/60 主分类号 H01L21/60
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