| 摘要 |
<p>PURPOSE:To provide an IC in which only a predetermined part to be soldered of a lead frame is spread-coated with a clad material formed of tin, lead or their alloy solder and a method for soldering the IC. CONSTITUTION:An IC has a lead frame 4 formed of a base material such as 42 alloy material of iron-nickel series or copper series material having a thickness of 0.125-0.27mm, and uses an IC 3 in which only a predetermined part to be soldered of the frame 4 is spread-coated with a clad material 5 formed of tin, lead or their alloy solder having a thickness of 0.15-0.2mm. Flux is printed by a silk screening on a footprint 2 coated with solder coating 6 on a printed circuit board 1, the IC 3 is then placed, and passed through a reflow furnace so that metal of the material 5 is melted to be alloyed with the coating 6 of the footprint 2 and a solder fillet 7 is formed between an end of the frame 3 and the footprint 2, thereby completing soldering.</p> |
