| 摘要 |
PURPOSE:To improve an adhesiveness of a resin base material to an internal layer circuit in a multilayer printed wiring board, without any possibility of the generation of a haloing phenomenon. CONSTITUTION:A treatment for forming the film whose main substance is the oxide or hydroxide of Si, Zr or Ti on the surface of a circuit provided on the surface of a circuit board is performed. Thereby, the surface of the circuit can be made into a coarse surface by virtue of the film made of the oxide or hydroxide of Si, Zr or Ti, and the adhesiveness of a resin base material to this circuit, which is to be an internal layer circuit in the case of manufacturing a multilayer printed wiring board, can be improved. Since these oxide and hydroxide are not dissolved in acids, there is no possibility of the generation of haloing. |
