| 摘要 |
PURPOSE:To realize a semiconductor device which can prevent the short circuit by the contact between the fellow bonding wires connecting a semiconductor chip with outside electrically. CONSTITUTION:A plurality of pads 2 are arranged along a semiconductor chip 1. Here, the interval between the pad 2a arranged at the corner of the semiconductor chip 1 and the adjacent pad 2b is set than the interval between the other pads 2. |
