| 摘要 |
PURPOSE:To provide a wire bonding device which can achieve high bonding work efficiency while suppressing the heating temperature in bonding work low and fulfilling the security of the adhesive force at the junction and the safety in junctioning at the same time. CONSTITUTION:A lead frame 31 is positioned in a bonding work position by a positioning mechanism, and ultrasonic vibration is applied to this positioned lead frame 31 by a bonding tool 62, and also desired vibration is applied with a vibration unit 13, whereby optimum composite vibration can be gotten. |
