发明名称 RESIN SEALED STRUCTURE FOR LED
摘要 PURPOSE:To retard exfoliation of epoxy resin from a printed board. CONSTITUTION:A printed board 11 is fixed to the back face side of a light reflecting case 10 having a hole 10a for fixing an LED element and 8 pair of bonding pads 12, 13 are provided on the substrate 11 in the hole 10a while a LED element 14 is fixed to the pad 12. The LED element 14 and the pad 13 are connected through a wire 15 and the hole 10a is sealed with epoxy resin 16 thus providing the pads 12, 13 with a complex pattern for increasing adhesion area between the epoxy resin 16 and an exposed face 11a of the substrate.
申请公布号 JPH0653553(A) 申请公布日期 1994.02.25
申请号 JP19920201262 申请日期 1992.07.28
申请人 ROHM CO LTD 发明人 MANO YASUHISA;FUJII TAKEHIRO
分类号 H01L21/56;H01L23/02;H01L23/28;H01L33/56;H01L33/60 主分类号 H01L21/56
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