发明名称 |
RESIN SEALED STRUCTURE FOR LED |
摘要 |
PURPOSE:To retard exfoliation of epoxy resin from a printed board. CONSTITUTION:A printed board 11 is fixed to the back face side of a light reflecting case 10 having a hole 10a for fixing an LED element and 8 pair of bonding pads 12, 13 are provided on the substrate 11 in the hole 10a while a LED element 14 is fixed to the pad 12. The LED element 14 and the pad 13 are connected through a wire 15 and the hole 10a is sealed with epoxy resin 16 thus providing the pads 12, 13 with a complex pattern for increasing adhesion area between the epoxy resin 16 and an exposed face 11a of the substrate. |
申请公布号 |
JPH0653553(A) |
申请公布日期 |
1994.02.25 |
申请号 |
JP19920201262 |
申请日期 |
1992.07.28 |
申请人 |
ROHM CO LTD |
发明人 |
MANO YASUHISA;FUJII TAKEHIRO |
分类号 |
H01L21/56;H01L23/02;H01L23/28;H01L33/56;H01L33/60 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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