| 摘要 |
<p>PURPOSE:To provide a substrate mounting method capable of separating readily a substrate from a heater heat plate without causing racks, distortions, or the like after the substrate is processed at a high temperature in an oxygen atmosphere such as a thin film growth, etc., when the substrate is adhered to the heater heat plate by adhesives. CONSTITUTION:On a substrate 3 surface on the adhesive side, a metallic thin film 4 has beforehand been formed by an accumulating method and the substrate 3 is stuck to a heater heat plate 1 by adhesives 2 containing a metal from the side where the metallic thin film 4 is formed.</p> |
