| 摘要 |
PURPOSE:To prevent reactive bonding of a product while a low temperature baking ceramics substrate is baked, by using a pedestal made of aluminum nitride as the pedestal for baking. CONSTITUTION:First, a plurality sheets of green sheet consisting of glass frit, filler and organic binder are prepared. Next, a conductor paste consisting of silver-paradium, silver, gold, copper and platinum is formed on the entire surface of the green sheets. Moreover, the test is conducted leaving the green sheet on which conductor paste is not formed. These green sheets are put on the pedestal of two kinds of materials (sintered body of alumina or sintered body of aluminum nitride) and are baked at the standard baking temperature of the low temperature baked ceramics substrate in order to observe the reacting and bonding conditions of the sintered body (low temperature baked ceramics substrate) and pedestal. As a result, it has been confirmed that aluminum nitride does not react and is not bonded with conductors such as silver-paradium, silver, gold, copper and platinum, etc., provided thereon during the baking process and it can preferably be used to form pedestal for the baking process. |
