| 摘要 |
PURPOSE:To prevent damage of a semiconductor chip due to discharge of static electricity or electrification of sealing resin. CONSTITUTION:Hollow lead terminals 1 connected to a semiconductor chip 3 via fine metal wires are so provided as to be disposed inside from a surface of sealing resin 4. Thus, discharge due to contact of the terminal 1 with a grounded metal part is prevented to prevent electrostatic damage of the chip 3. |
