Verfahren zur Herstellung fein strukturierter elektrisch leitfähiger Schichten

摘要

A process is disclosed for producing finely structured conductive layers on a substrate, for example printed circuit cards. In order to improve the fineness of the structure and contour sharpness, a thin activation layer having the desired structure is at first applied on the substrate, preferably by printing, and then a thicker conductive layer made of an electroconductive metal, such as copper or nickel, is added to the activation layer, by precipitation from a corresponding galvanic bath or by a currentless process from a corresponding reduction bath.