ELECTRICAL INTERCONNECTION SUBSTRATE WITH BOTH WIRE BOND AND SOLDER CONTACTS,AND FABRICATION METHOD

摘要

An electrical interconnection substrate (20) is prepared to receive both wire bonded and soldered connections (60, 64, 66) by forming a dielectric solder mask (30) over the substrate (20), with openings in the mask (30) to expose the contact pads (22) with a solder layer (52) and (22') for wire bonding. The substrate (20) is exposed to a molten solder alloy (44) in a wave soldering process that dissolves the wire bonding material (28) (preferably gold) from the first exposed pads (22) and deposits solder bonding pads (52) in its place. Excess solder is then removed from the substrate, and openings are formed through the solder mask (30) to expose the wire bond contact pads (22'). The selective dissolving of gold bonding layers (28) and their replacement by solder pads (52) prevents the establishment of brittle gold-solder intermetallics, and the deposited solder (52) requires no further heat treatment for correct alloy formation.