| 摘要 |
<p>A connector comprising a housing comprising a resin composition containing (A) from 50 to 92 parts by weight of a semi-aromatic polyamide having a melting point of not less than 270 DEG C and less than 310 DEG C as measured with a differential scanning calorimeter, (B) from 5 to 35 parts by weight of a modified polyolefin obtained by graft-modifying polyethylene with 0.05 to 5 mol% of an alpha , beta -unsaturated carboxylic acid, an anhydride thereof, or a derivative thereof, and (C) from 3 to 15 parts by weight of polyamide 12, per 100 parts by weight in total of the resin composition. <IMAGE></p> |
