发明名称 |
Tape automated bonding(tab)semiconductor device and method for making the same |
摘要 |
Deformation of TAB tapes due to temperature changes is prevented by thermo-mechanical leads. In one embodiment of the invention, a semiconductor device (30) includes an electronic component (31) and a TAB tape. The tape includes a carrier film (12) and electrical leads (20) formed on the carrier film. The electrical leads are electrically coupled to the electronic component. Also included on the carrier film are thermo-mechanical leads (32) which are formed in opposing regions of the carrier film, regions which are typically void of leads. The thermo-mechanical leads have approximately the same lead pitch as the electrical leads in order to provide a uniform distribution of stresses across the TAB tape upon exposure to varying temperatures. |
申请公布号 |
US5289032(A) |
申请公布日期 |
1994.02.22 |
申请号 |
US19910745655 |
申请日期 |
1991.08.16 |
申请人 |
MOTOROLA, INC. |
发明人 |
HIGGINS, III, LEO M.;KARPMAN, MAURICE S. |
分类号 |
H01L21/60;H01L23/495;H05K1/00;H05K1/02;(IPC1-7):H01L23/48;H01L29/44;H01L29/52 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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