| 摘要 |
A multilayer connector is provided, in which at least a first wiring layer is formed, a second wiring layer is formed on the first wiring layer through an interlevel insulator, a contact hole is bored through the interlevel insulator at its portion in which the first and second wiring layers are connected, a coupling conductor is formed within the contact hole and the first and second wiring layers are electrically connected to each other by means of the coupling conductor. A recess portion having an opening is formed on the first wiring layer, the opening of the recess portion being increased in width from a peripheral edge of the contact hole, wherein the coupling conductor formed within the recess portion by a selective chemical vapor deposition process is formed within the contact hole of the interlevel insulator.
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