发明名称 Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
摘要 A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.
申请公布号 US5288542(A) 申请公布日期 1994.02.22
申请号 US19920913101 申请日期 1992.07.14
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CIBULSKY, MICHAEL J.;PAPATHOMAS, KONSTANTINOS I.;SUMMA, WILLIAM J.;WANG, DAVID W.;ZIPPETELLI, PATRICK R.
分类号 H05K1/03;H05K3/00;(IPC1-7):B32B03/00 主分类号 H05K1/03
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