Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
摘要
A composite for providing a rigid-flexible circuit board includes at least one core that contains a dielectric substrate and at least one conductive layer thereon; at least one sub-composite that includes a polyimide and a rigid dielectric substrate; a release layer; at least one rigid bonding layer and a second conductive layer. The composite is used in the fabrication of a rigid-flexible circuit board.
申请公布号
US5288542(A)
申请公布日期
1994.02.22
申请号
US19920913101
申请日期
1992.07.14
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
CIBULSKY, MICHAEL J.;PAPATHOMAS, KONSTANTINOS I.;SUMMA, WILLIAM J.;WANG, DAVID W.;ZIPPETELLI, PATRICK R.