| 摘要 |
PURPOSE:To obtain a sold resist ink composition which contains an epoxy resin having a specific structure, thus shows a high heat distortion, gives the cured coating films of high heat resistance, electric insulation, adhesion, hardness, moisture resistance and plating resistance with bleeding reduced. CONSTITUTION:The composition comprises an epoxy resin of the formula I [Z is formula II, III (R is H, halogen); m, n are 0 to 10 where m+n is 0 to 10]. The resin of formula I is obtained by reaction of an epoxy resin of formula IV with a compound of the formula: HO-Z-OH in the presence of a catalyst such as tetramethylammonium chloride at 70 to 105 deg.C for 4 to 10 hours. The compound of the formula: HO-Z-OH is prepared by reacting a methylol such as 1-methylol-2-naphthol with a naphthol such as 1-naphthol, while the epoxy resin of formula IV is preferably prepared by reaction of a compound of the formula: HO-Z-OH with epichlorohydrin. |
