| 摘要 |
A method and an apparatus of measuring a state of an IC lead frame are disclosed. The method has the steps of detecting a first projective position of an upper edge of a lead terminal of the IC lead frame on a reference surface and a second projective position of the upper edge, the second projective position of the upper edge having a projective angle different from that of the first projective position of the upper edge, detecting a first projective position of a lower edge of the lead terminal on the reference surface and a second projective position of the lower edge, the second projective position of the lower edge having a projective angle different from that of the first projective position of the lower edge, and computing the state of the lead terminal from the detections of the projective positions. The apparatus has a sensor transmitting beams of light at least at two different angles so as to sense an edge of a lead terminal of the IC lead frame at the angles, a mechanism moving the sensor along the IC lead frame transversely to the longitudinal axis of the lead terminal, a detector for a position of the sensor, and a computer computing a state of the lead terminal from an edge detection by the sensor and a detection of the position of the sensor by the position detector.
|
